The UV-sensitive viscosity adjustable composite film is specially designed for wafer grinding, cutting and carrying processing of soft electronic parts. It has a high adhesive force and can instantly reduce the adhesive force by ultraviolet radiation. Product features: to ensure that the wafer does not shift or peel during cutting, so that the wafer does not fall off or scattered during the grinding, cutting and pick-up process; there is no residual glue; the UV response time is fast, and the work efficiency is effectively improved.